semiprobesinc

semiprobesinc

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  1. Flip Chip & Solder Bump Probing

    Flip Chip & Solder Bump Probing

    While wire bond technology has met the majority of the semiconductor industry’s need for low cost and reliability, the increasing density of chips and the number ...
  2. Probe Material Characteristics

    Probe Material Characteristics

    The purpose of this document is to define the probe material characteristics for probe cards built on a defined standard procedure. Industry Standards are used to ...